All- in-one Sorting and testing System

This solution is mainly used in the backend production of semiconductor chips. It can fully automate various functions such as chip appearance and size inspection, electrical parameter testing, laser marking, mark inspection, classification, sorting and storage, and final taping and packaging output. With the help of independently developed host computer software, it offers industry-leading testing speed and precision.

System overview

System features

Industry-leading UPH

Save floor space

Flexible compatibility and scalability

Fast equipment deployment and high cos performance

Suitable for RF microwave devices such as SAW, LTCC, Switch

Technical specifications

Sorting Machine Specification
CSP Type DFN/QFN/SOT/SOD
Chip Size 0.4*0.4mm→1*1mm
UPH Max ≥45K/H
Test Station QTY 2~4
Package Sealing Heat-Sealing Packaging
Taping Reel size 7~13"
Power supply 220VAc 50Hz
Compressed air source 0.45~0.8Mpa & -40~-80Kpa
Sealing temperature 70℃~250℃
Sealing time 20ms~500ms
Sealing pressure 0.2~0.5Mpa
Precise positioning ≤5arcsec
MTBA ≥1 H
MTBF ≥168H
Feeding method Vibratory Feeder
Discharging method Taping
Polarity Testing Vision test station
Rotation/Steering Positioning error≤10arcsec
Sub-Tray Positioning accuracy≤5arcsec
Vision1 Orientation
Vision2 Print/Mark
Vision3 Pins
Vision4 Taping
Test method Press testing
Sorting device Bin bucket or bin tube
Human-machine Interface Touch screen/keyboard-mouse
MTTA ≤3 minutes

Main Turret Operation Flow:

M1 Product Feeding Mechanism
M2 Positioning and Alignment
M3 Sub-Turret Vision Inspection
M4 NC
M5 Rotary Positioning #1
M6 Testing
M7 NC
M8 NC
M9 NC
M10 Rotary Positioning #2
M11 2-Second Side Vision Inspection
M12 Bottom Vision Inspection
M13 Classification (1:8)
M14 Good Product Conveyor
M15 NC
M16 Tape and Reel Packaging Mechanism
M17 Purge Bin
M18 NC

Main Turret:

Driven by an imported DD motor and drive unit, equipped with 18 suction cups. (Can be upgraded to 4/36 suction cups)